Application-specific integrated circuit equivalents of programmable logic and associated methods

ABSTRACT

Providing ASIC equivalents of FPGAs is facilitated and made more efficient and economical by using an ASIC architecture including a plurality of so-called hybrid logic elements (“HLEs”), each of which can provide a portion of the full functionality of an FPGA logic element (“LE”). The functionality of each FPGA LE implementing a user&#39;s logic design can be mapped to one or more HLEs without re-synthesis of the user&#39;s logic. Only as many HLEs as are necessary are used to perform the functions of each LE. The one-for-one equivalence between each LE and either (1) one HLE or (2) a group of HLEs facilitates mapping (without re-synthesis) in either direction between FPGA and ASIC designs.

BACKGROUND OF THE INVENTION

This invention relates to circuitry for application-specific integratedcircuits (“ASICs”) that can be used as equivalents of or substitutes forprogrammable logic circuitry (PLDs or FPGAs). The invention also relatesto transferring designs for particular uses of an ASIC or a PLD (orFPGA) between those two types of devices so that deviceinterchangeability is achieved.

A typical programmable logic device (“PLD”) or field-programmable gatearray (“FPGA”) includes many logic elements (“LEs”) of a fixed size.(For convenience herein, the term FPGA is used as a generic term forPLDs and FPGAs.) For example, an FPGA LE may include a four-inputlook-up table (“LUT”), a register, and some routing circuitry thatallows the register to be either used (e.g., to register the output ofthe LUT) if sequential logic or operation is desired, or to be bypassedby the LUT output if only combinational or combinatorial logic oroperation is desired. An FPGA LE may also have other features orcapabilities, but the foregoing example will be sufficientlyillustrative. In addition to many LEs, an FPGA also typically hasprogrammable routing circuitry for conveying signals to, from, and/orbetween the LEs in any of many different ways so that very complexand/or extensive logic or logic-type operations can be performed bycombining or otherwise using multiple LEs. Also in addition to LEs, anFPGA may have other types of circuitry, such as input/output (“I/O”)circuitry, blocks of memory, microprocessors, special-purpose circuitrysuch as digital signal processing (“DSP”) blocks, high-speed serialinterface (“HSSI”) blocks, etc. These other types of circuitry may alsobe interconnectable to one another (and to the LEs) via theabove-mentioned programmable routing circuitry.

FPGAs have many advantages that are well known to those skilled in theart. In some instances, however, it may be desired to have an ASICequivalent of an FPGA design so that cost can be reduced in ahigh-volume application. For example, a design may start out in an FPGA.But after that design has been sufficiently proven and has reachedsufficiently high volume, substituting an ASIC equivalent can be verycost-effective.

One known approach to providing ASIC equivalents to FPGAs employs anASIC architecture having the same basic organization of LEs as thestarting FPGA. For example, if the FPGA includes an array of LEs, eachof which has a four-input LUT (“4-LUT”) and a register, then the ASIChas a similar array of LEs including 4-LUTs and registers. Certainlayers in the ASIC are then customized to a particular user's design toeffectively “program” the LEs and to provide the requiredinterconnection routing among the LEs.

The foregoing approach to providing ASIC equivalents of FPGAs has manyadvantages. However, improvements are always sought. For example, mostuser designs do not make use of all the circuitry on an FPGA. Somefraction of the FPGA circuitry is generally unused. A 4-LUT may only beused to provide a two- or three-input function. Or either the LUTs orthe registers (but not both) in some LEs may be used. In any of thesecases, substantial amounts of the circuitry in theless-than-fully-utilized LEs is effectively wasted. If the same basic LEstructure forms the basis for the equivalent ASIC, the same waste willbe replicated in the ASIC.

SUMMARY OF THE INVENTION

In view of the foregoing, an ASIC architecture in accordance with thisinvention includes logic elements that are not the same as the LEs in anequivalent FPGA. These ASIC logic elements are referred to herein ashybrid logic elements (“HLEs”). Each HLE may include a relatively small,general-purpose, combinatorial logic component (e.g., a one-input LUT or“1-LUT”), a relatively small array of logic gates (e.g., two two-inputNAND gates), and some associated interconnection or routing resources.The amount of operational circuitry in an HLE (e.g., the 1-LUT and theNAND gates) is much less than the amount of operational circuitry in arelated FPGA LE. At some least aspects of the routing resources in anHLE are programmable (e.g., mask programmable using vias) for suchpurposes as making input connections to the HLE, output connections fromthe HLE, and internal connections within the HLE. For some relativelyunder-utilized FPGA LEs, one ASIC HLE can perform the functions of theLE. If an LE has greater utilization, then several adjacent (or at leastnearby) HLEs may be needed to equivalently perform the LE's functions.The routing resources of HLEs facilitate interconnecting adjacent (ornearby) HLEs that need to be put together to perform any LE's functions.In any case, only as many HLEs as are necessary to perform an LE'sfunctions are used to provide an equivalent of that LE. Because many LEsin most designs are not fully utilized, the number of HLEs provided onan ASIC for use as equivalent to an FPGA can be significantly less thanthe number of HLEs that would be required if all LEs were fullyutilized. This is a significant ASIC size reduction as compared to anASIC that uses a fully featured LE for each FPGA LE.

At least to a large extent, there is preferably a one-for-onecorrespondence between each LE and the equivalent HLE or group of HLEs.This facilitates converting an FPGA design to the equivalent ASIC, andalso vice versa, without re-synthesis of the user's logic. Avoiding suchre-synthesis can save time and cost, and it also gives greater assurancethat the ASIC and FPGA equivalents will function substantiallyidentically and without fault (assuming that either the FPGA or the ASIChas been proven to function properly).

Further features of the invention, its nature and various advantages,will be more apparent from the accompanying drawings and the followingdetailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified schematic block diagram of an illustrative,known, FPGA LE.

FIG. 2 is a simplified schematic block diagram of an illustrative,known, ASIC equivalent of an FPGA LE.

FIG. 3 is a simplified schematic block diagram of an illustrative ASICHLE in accordance with this invention.

FIGS. 4-9 are simplified perspective or elevational views ofillustrative programmable interconnect structures for ASICs inaccordance with the invention.

FIG. 10 is a simplified schematic block diagram of an illustrative,programmed, ASIC HLE in accordance with the invention.

FIG. 11 is a simplified schematic block diagram of another illustrative,programmed, ASIC HLE in accordance with the invention.

FIG. 12 is a simplified schematic block diagram of an illustrative,programmed, pair of ASIC HLEs in accordance with the invention.

FIG. 13 is a simplified schematic block diagram of another illustrative,programmed, pair of ASIC HLEs in accordance with the invention.

FIG. 14 is a simplified schematic block diagram of several illustrativeASIC HLEs with illustrative additional programmable interconnectioncircuitry in accordance with the invention.

FIG. 15 is a simplified block diagram showing an illustrativearrangement of HLEs on an ASIC in accordance with the invention.

FIG. 16 is a simplified block diagram showing an example of use of HLEson an ASIC in accordance with the invention.

FIG. 17 is a simplified schematic block diagram showing an example ofadditional programmable interconnection circuitry on an ASIC inaccordance with the invention.

FIG. 18 is a flow chart for illustrative methods in accordance with theinvention.

FIG. 19 is another flow chart for illustrative methods in accordancewith the invention.

FIG. 20 is still another flow chart for illustrative methods inaccordance with the invention.

FIGS. 21 a-c, 22 a-c, and 23 are schematic block diagrams showingillustrative uses of certain possible components of HLEs in accordancewith the invention.

DETAILED DESCRIPTION

An illustrative, known, FPGA LE 10 is shown in FIG. 1. LE 10 includes a4-LUT portion 12 and a register portion 14. 4-LUT portion 12 includes 16programmable memory (e.g., RAM) cells 20-0 through 20-15. The outputs ofRAM cells 20 are applied, in respective pairs, to the inputs of eighttwo-input multiplexers (“muxes”) 22-0 through 22-7. 4-LUT input Acontrols which of its inputs (from RAM cells 20) each of muxes 22selects to be its output. For example, if input A is logic 1, each ofmuxes 22 selects its upper input to be its output. If input A is logic0, each of muxes 22 selects its lower input to be its output. Theoutputs of muxes 22 are applied, in respective pairs, to the inputs offour two-input muxes 24. 4-LUT input B controls which of its inputs eachof muxes 24 selects as its output. Again, if B is logic 1, muxes 24select their upper inputs to output. If B is logic 0, muxes 24 selecttheir lower inputs to output. The outputs of muxes 24 are applied, inrespective pairs, to the inputs of two two-input muxes 26. 4-LUT input Ccontrols which of its inputs each of muxes 26 selects as its output. Thelogic is similar to that for muxes 22 and 24. The outputs of muxes 26are applied to two-input mux 28. 4-LUT input D controls which of itsinputs mux 28 outputs (following the same logic as for inputs A-C).

The output signal of mux 30 is applied to driver circuit 30. The outputof driver 30 is one output (the combinatorial output 32) of LE 10. Theoutput of driver 30 is also applied to one input terminal of mux 40. Theother input to mux 40 is another input to LE 10. Mux 40 is controllable(e.g., by programmable RAM cell 42) to select either of its inputs forapplication to the data input terminal of register 44. This arrangementallows register 44 to be used to register another signal if it is notneeded to register the output of LUT 12. The output of register 44 isthe registered output 46 of LE 10.

FIG. 2 shows a possible, known, ASIC equivalent of LE 10 configured as atwo-input AND gate (without registration of the output). Elements inFIG. 2 that are similar to elements in FIG. 1 have reference numbersthat are increased by 100 from their FIG. 1 reference numbers. Thus inASIC LE 110, inputs C and D are ANDed to produce the unregistered LEoutput 132. The inputs of muxes 122-0 and 122-1 are tied to logic 1. Theinputs of the other muxes 122 are tied to logic 0. This has the effectof rendering inputs A and B “don't care” inputs. Only inputs C and D canaffect the output, and they do so in a way that the output is the AND ofC and D. This use of LE 110 means that the elements in which an X hasbeen placed are effectively unused. In particular, all of elements 122,124, 126-1, 140, and 144 are effectively unused. It is therefore aconsiderable waste for all of these elements to be included in the ASICcircuitry that is provided to make an equivalent of an FPGA LE 10 havingsuch relatively low utilization. Logic reduction (see, for example, FooU.S. patent application Ser. No. ______, filed Jun. 4, 2004 (AttorneyDocket 174/309 (A877))) can be used to reduce the amount of circuitrythat must be provided in ASIC LE 110. For example, the first level ofmuxing (122) can be eliminated by selectively using input A and itscomplement as the inputs to the next level of muxing (124).Nevertheless, a significant amount of the circuitry of even such areduced ASIC LE 110 is wasted whenever an under-utilized FPGA LE 10 isbeing implemented.

FIG. 3 shows an illustrative embodiment of a so-called hybrid logicelement (“HLE”) 200 constructed in accordance with this invention foruse, either alone or in multiples, in providing less wasteful ASICequivalents of FPGA LEs. Although the particular HLE 200 constructionshown in FIG. 3 will now be described in some detail, it is emphasizedhere as a preliminary point that this embodiment is only one example,and that many variations of this construction are possible withoutdeparting from the scope and spirit of the invention.

HLE 200 includes two-input multiplexer (“mux”) 210, two two-input NANDgates 220 a and 220 b, two inverting buffers or drivers 230 a and 230 b,and interconnection resources that are described more fully in the nextseveral sentences. The interconnection resources shown in FIG. 3 includea plurality of vertical conductors 240 upstream from mux 210, aplurality of vertical conductors 250 between mux 210 and NAND gates 220,one (or more) vertical conductor(s) 260 between NAND gates 220 anddrivers 230, and a plurality of vertical conductors 270 downstream fromdrivers 230. The interconnection resources shown in FIG. 3 also includeseveral horizontal conductors (e.g., conductors 310, 320, 330, and 340).Conductors 240, 250, 260, 270, 310, 320, 330, and 340 are relativelygeneral-purpose conductors, by which it is meant that they can be usedto make any of several different links between any of several differentsources and any of several different destinations. In addition to theserelatively general-purpose conductors, HLE 200 includes severalmore-specialized conductors. For example, conductor 350 is dedicated tosupplying the control input to mux 210 (although there can be any ofseveral sources for that control input signal, as will be described inmore detail below, and conductor 350 can also be put to other use ifdesired). As another example, conductors 360 a and 360 b are dedicatedto supplying the two selectable inputs to mux 210 (again from any ofseveral possible sources, and again with additional possible use ifdesired). As still another example, conductor 370 is dedicated toconveying the output of mux 210, although that output can go to any ofseveral destinations. Although some conductors have been described asrelatively general-purpose, and other conductors are described as morespecialized, these descriptive concepts are employed only forconvenience. They are not intended to be limiting. Nor is there anydefinite distinction between the two, or any necessity for both types tobe present.

The small solid dots 410 at conductor intersections in FIG. 3 representlocations at which connections between the intersecting conductors canbe made or not made as desired. These connections are thereforeprogrammable. In the preferred embodiments these connections aremask-programmable using vias that are either included or not included inone or more layers between the layers containing the intersectingconductors. (Although via programming is generally referred to herein,this is only an example, and any of several other programmingtechnologies can be used instead if desired. Other examples of usableprogramming technologies are mentioned later in this specification.)FIG. 4 shows two intersecting conductors 240 and 320 in respectivedifferent metal layers on an integrated circuit device that includes HLE200. In FIG. 4 these conductors are electrically connected to oneanother by a via 420 through an insulating layer between the two metallayers. The same structure is shown again in FIG. 5 without a viathrough the insulating layer. Accordingly, in FIG. 5 conductors 240 and320 are not connected to one another. (Whether conductor 240 or 320 isin the higher or lower metal layer is arbitrary and a matter of designchoice.)

The Xs 430 in FIG. 3 represent locations at which conductor segments canbe programmably connected to one another or not as desired. The sametechnology choices as described above for small solid dots 410 aresuitable for connections 430. For example, FIG. 6 shows two segments ofrepresentative conductor 320 connected by mask-programmable vias 440 tobridging conductor 450. Accordingly, these two segments of conductor 320are electrically connected to one another by way of vias 440 andbridging conductor 450. FIG. 7 shows the same structure but without vias440. Accordingly, in FIG. 7 conductor segments are not connected to oneanother. Rather, they are electrically insulated from one another.

The large open circles or ovals 460 in FIG. 3 represent locations atwhich the conductors having those circles or ovals can be programmablyconnected to what may be called a higher level of interconnectionresources (not shown in FIG. 3) on a device that includes HLE 200. Thishigher level of interconnection resources may be used for such purposesas conveying signals between components (e.g., HLEs, device input/output(“I/O”) ports, etc.) that may not be adjacent or relatively close to oneanother. (The phrase “higher level” does not necessarily mean aphysically higher level, but only a hierarchically higher level.)Programmable connections 460 can be made in any of the ways describedabove (e.g., for programmable connections 410). For example, FIG. 8shows representative conductor 360 connected to higher level conductor510 by mask-programmable via 470. FIG. 9 shows the same structurallocation 460 again, but now with no connection between conductor 360 andhigher level conductor 520.

In FIG. 3 conductors shown extending along different axes always connectto one another if one of these conductors is shown ending at the otherconductor (or if both conductors are shown ending at the otherconductor). Conductors shown crossing one another without a small soliddot at the intersection are preferably not connectable to one another atthe intersection.

Certain conductors are shown in FIG. 3 as having particular externalconnections. Thus the top-most conductor 310 is shown as alwaysconnected to VCC (e.g., logic 1). The next-to-top-most conductor 310 inFIG. 3 is shown as always connected to VSS (e.g., logic 0). Conductors312, 314, and 316 are shown as input connections from other adjacentHLEs above, to the left, and below the depicted HLE. Conductor 332provides the input 316 to the HLE above the depicted HLE. Conductor 272provides the input 314 to the HLE to the right of the depicted HLE.Conductor 342 provides the input 312 to the HLE below the depicted HLE.These so-called “sneak” connections between adjacent or nearby HLEs canbe an always-provided, fixed part of the interconnection resources ofthe device. Whether they are actually used (and how they are used) canbe programmable as a result of how the programmable connections 410 atone or both ends of the sneak connections are programmed.

The Xs 430 at the depicted ends of conductors like 240 and 250 representlocations at which those conductors can be programmably connected tosimilar conductors in other HLEs adjacent to the depicted HLE.

One HLE 200, or a relatively small but suitable number of adjacent ornearby HLEs 200, can be used to perform any function or functions thatcan be performed by an FPGA LE such as 10 in FIG. 1. In each case, onlyas many HLEs as are required to perform the LE's function(s) areemployed to produce an ASIC equivalent of the FPGA LE.

FIG. 10 shows a somewhat simpler form of HLE 200 a (or at least asimplified representation of HLE 200 (FIG. 3)) being used to provide anoutput Y, which is A XOR B. The interconnection resources of HLE 200 athat are actually in use in this example are drawn using much heavier(thicker) lines. Other interconnection resources that are present butnot in use in this example are represented by the lighter (thinner)lines. Input A is applied to the upper input terminal of mux 210. Forexample, input A may come into HLE 200 a by way of the programmableconnection 460 (FIG. 3) shown on the corresponding mux input IN0 in FIG.3. Thus input A may come in from a conductor (like 510 in FIG. 8) in thehigher level interconnection circuitry of the device. Input A is alsoapplied to both input terminals of NAND gate 220 b in FIG. 3. Thiscauses NAND gate 220 b to operate as an inverter, as shown in FIG. 10.Again, these inputs of A may be by way of the programmable connections460 to the left of NAND gate 220 b in FIG. 3. The output of inverter 220b (FIG. 10) is fed back to the lower input of mux 210 (e.g., by way ofconductor 322, a programmable connection 410 (FIG. 3) to one of verticalconductors 240, a portion of that vertical conductor, anotherprogrammable connection 410 to conductor 360 b, and a portion of thatconductor 360 b).

Input B is applied to the control input of mux 210 by way of conductor350. For example, input B may be applied to conductor 350 by way of theprogrammable connection 460 shown on that conductor in FIG. 3. Thusinput B may come into HLE 200 a from the higher level interconnectioncircuitry of the device. When input B is logic 0, mux 210 outputs thesignal on the upper one of its two selectable input leads (i.e.,conductor 360 a). When input B is logic 1, mux 210 outputs the signal onthe lower one of its two selectable input leads (i.e., conductor 360 b).Accordingly, the output signal of mux 210 is A XOR B.

The output signal of mux 210 is applied to both inputs of NAND gate 220a (FIG. 3), which therefore acts as an inverter. The output of NAND gate220 a is applied to inverting driver 230 a, which again inverts thesignal. Accordingly, the combined effect of elements 220 a and 230 a,used in this way, is to provide a non-inverting output driver for theoutput signal of mux 210, i.e., Y (=A XOR B).

The routing of the mux 210 output signal to the two input terminals ofNAND gate 220 a can be by way of a portion of conductor 370, aprogrammable connection 410 (FIG. 3) from that conductor to one ofvertical conductors 250, a portion of that vertical conductor 250, andtwo more programmable connections 410 from that conductor to the twoinputs to NAND gate 220 a. The Y output of driver 220 a/230 a can beconnected into the higher level interconnection circuitry by way of theprogrammable connection 460 (FIG. 3) on the output lead of inverter 230a.

FIG. 10 thus shows one example of a logic function that can be performedin a single HLE with relatively little waste of resources. Performanceof this function in an ASIC LE comparable to an FPGA LE (analogous towhat is shown in FIGS. 1 and 2) would leave a substantial portion of theASIC LE resources unused and therefore wasted (even with logic reductionof the type mentioned above toward the end of the discussion of FIG. 2).An HLE construction as shown herein provides a much less wastefulimplementation.

FIG. 11 shows another example of a logic function that can beimplemented in a single HLE 200 b (again like HLE 200 in FIG. 3 or atleast conceptually similar thereto). The function implemented in FIG. 11is Y=(A AND C′) OR (B AND C). Conductors and elements that are used inFIG. 11 are shown with heavier lines. Conductors and elements that arenot used in FIG. 11 are shown with lighter lines. The manner in whichsignals are routed into, through, and out of HLE 200 b will be apparentfrom the foregoing discussion and therefore will not require furtherdetailed description.

FIG. 12 shows an example of a four-input combinational logic functionimplemented in two adjacent HLEs 200 c and 200 b, each of which can belike HLE 200 in FIG. 3 or at least conceptually similar thereto. Thefunction implemented is F=(A(BC+B′D)+A′)′. The elements and conductorsused to implement this function are shown using heavier lines in FIG.12. Unused elements and conductors are shown using lighter lines. FIG.12 illustrates the use of a sneak connection to convey a signal from oneHLE to another adjacent or nearby HLE. In this case the output signal ofmux 210 in HLE 200 c is conveyed to HLE 200 d via a sneak connectionlike 272/314 in FIG. 3. (It will be apparent from FIG. 3 and what hasbeen said earlier in this specification how the output of mux 210 can berouted to sneak right output 272, from there to sneak input 314 of theHLE to the right, and from that input to an input of the mux 210 in theHLE to the right.) FIG. 12 also illustrates the use of a VCC input(logic 1) to elements 210 and 220 a in HLE 200 d. This can be done usingone of conductors 310 as shown in FIG. 3 and programmable routing (e.g.,programmable connections 410) from that conductor to the desired inputsof element 210 and 220 a.

FIG. 12 shows some additional interconnection between horizontallyadjacent HLEs that is not shown (at least not explicitly) in FIG. 3.These are more extensive connections from each HLE to the HLE to theright. FIG. 3 may imply that only a sneak connection is available forsuch routing. But FIG. 12 shows three signals (the output of mux 210 andthe outputs of NAND gates 220 a and 220 b) able to flow from each HLE tothe HLE to the right, at the hierarchical level of the HLE routingresources. This additional, relatively direct, HLE-to-HLE routing isjust one example of the many different ways it is possible to constructHLEs in accordance with the invention. Of course, if such additionaldirect connections were not provided at the HLE level, similarconnections could be made using higher level interconnection circuitry.However, it is presently believed desirable to provide sufficientrelatively direct, HLE-to-HLE routing capability (including sneakconnections) to allow at least a substantial portion (preferably atleast most) of the HLE-to-HLE connections that are needed by a group ofHLEs performing the function(s) of any FPGA LE. The higher level routingcan then be reserved for longer-distance interconnections.

FIG. 13 shows an example of use of two adjacent HLEs 200 e and 200 f toprovide a flip-flop or register (one of the capabilities of a typicalFPGA LE). Once again, each of HLEs 200 e and 200 f can be like (or atleast conceptually similar to) HLE 200 in FIG. 3. Elements andconductors used to provide the flip-flop are shown with heavy lines inFIG. 13. Unused structure is shown in lighter lines. It will not benecessary to describe all of the connections shown in FIG. 13, or howthose connections are achieved, because that information will beapparent from the FIG. and the earlier description. It will besufficient to say that the signal D to be registered can come into HLE200 e by way of a programmable connection 460 (FIG. 3) from higher levelinterconnection circuitry of the device, or at a lower level fromanother adjacent or nearby HLE. The same is true for the clock signalCLK that clocks the flip-flop. (This signal is needed by both of HLEs200 e and 200 f.) Alternatively, CLK could come into each HLE in amanner like that shown for VCC and VSS in FIG. 3. FIG. 13 shows CLR′ andSET′ signals coming into each HLE 200 e and 200 f by way of conductor250 programmable connections 430 (FIG. 3) from similar conductors inadjacent HLEs above and below. Ultimately these signals may enter theHLE array the way signals like VCC and VSS are shown entering in FIG. 3,or by way of programmable connections 460 (FIG. 3) to higher levelinterconnection circuitry of the device. The registered outputs Q and Q′of the flip-flop can enter the higher level interconnection circuitry ofthe device by way of more programmable connections 460, or they can goto other adjacent or nearby HLEs by way of lower level connections.

FIG. 14 shows several adjacent HLEs 200 g, 200 h, 200 i, and 200 j, withemphasis on certain (but not necessarily all) relatively directconnection resources between HLEs. In the embodiment shown in FIG. 14the inter-HLE interconnection resources include direct connection 222(shown as a heavy dashed line) from the NAND gate 220 a of HLE 200 h tothe HLE 200 j to the right. Another direct connection shown in FIG. 14is connection 212 (shown as a heavy dotted line) from the output of mux210 in HLE 200 h to the HLE 200 j to the right. Still another directconnection shown is sneak connection network 214 (shown as a heavy solidline), which extends from a sneak output of HLE 200 h to HLEs 200 g, 200i, and yet another HLE (not shown) to the right of HLE 200 j. In thisembodiment, the sneak output is shown as programmably selectable fromeither conductor 212 or 222, but other sources for this signal areequally possible. All of the HLE-to-HLE connection resources emphasizedin FIG. 14 (including the sneak connections) can be implemented in thesame levels of metal as are used for intra-HLE connection resources, andtherefore without recourse to the higher level interconnection circuitrythat is typically used for longer-distance interconnections.

FIG. 15 shows an illustrative arrangement of HLEs 200 on an integratedcircuit device 500. HLEs 200 in FIG. 15 may be constructed as shown inFIG. 3 or any other FIG. herein, or they may include any of themodifications referred to anywhere in this specification. In theillustrative arrangement shown in FIG. 15, HLEs 200 are disposed ondevice 500 in a two-dimensional array of intersecting rows and columns.Device 500 may also include other circuitry such as I/O blocks, memoryblocks, etc. (not shown). ASICs in accordance with this invention aretherefore preferably “structured ASICs” in the sense that they have abasic circuit organization or structure (e.g., the above-mentionedtwo-dimensional array of HLEs as shown in FIG. 15), to whichcustomizable modifications and/or additions are made (e.g.,interconnections within and/or among the HLEs). If device 500 is to beused as an ASIC equivalent of an FPGA, device 500 can generally beprovided with a total number of HLEs 200 that is less than the number ofLEs on the FPGA times the maximum number of HLEs 200 required toreproduce all the capabilities of one FPGA LE. This is so because onlyas many HLEs are used to perform the function(s) of each FPGA LE as arerequired, and in many cases fewer than the maximum number of HLEs areneeded for this purpose. Certain aspects of this point will become evenclearer as the description proceeds.

FIG. 16 shows how HLEs 200 on device 500 may be used singly or togetherin groups to perform the function(s) of the LEs in an equivalent FPGA.In FIG. 16 adjacent or nearby HLEs 200 that are used together are shadedthe same way, which is different than the shading used for otheradjacent or nearby HLEs. To facilitate reference, the HLE columns inFIG. 16 are numbered 1, 2, 3, etc., and the HLE rows are lettered A, B,C, etc. Using these row and column references, FIG. 16 shows HLEs beingused together as follows:

Group 1: A1/A2/B1

Group 2: A3/A4

Group 3: B2/C1/C2/C3

Group 4: B3/B4

Group 5: D1/E1/E2/F1

Group 6: D2/D3/D4

Group 7: F2

The above groupings might be performing the functions of LEs in anequivalent FPGA as follows:

Group 1: Combinational logic of FPGA LE A1

Group 2: Register function of FPGA LE A1

Group 3: Combinational logic of FPGA LE B1

Group 4: Register function of FPGA LE B1

Group 5: Combinational logic of FPGA LE C1

Group 6: Combinational logic of FPGA LE D1

Group 7: Combinational logic of FPGA LE E1

In the immediately above list, row letters and column numbers (likethose shown in FIG. 16) are used to reference LEs in a two-dimensionalFPGA LE array.

It will be understood that the example of HLE groupings shown in FIG. 16is only illustrative, and that many other groupings are equallypossible. The actual groupings employed in any particular case (ASIC)will be dictated by the FPGA LE functions that need to be equivalentlyperformed in that ASIC device 500. However, one preference suggested bythe illustrative listings in the two preceding paragraphs is thefollowing. It can be desirable for the functions of the FPGA LEs to beimplemented in the same general arrangement of ASIC HLEs. For example,one or more functions performed by an LE near the upper left-hand cornerof the FPGA are preferably performed by the required number of HLEs in acorresponding location (e.g., near the upper left-hand corner) of theASIC.

It should also be mentioned in connection with FIG. 16 that some HLEs200 in ASIC 500 may be unused.

For completeness, FIG. 17 shows some illustrative higher-levelinterconnection circuitry 510, 520, 530, 540, and 550 on an ASIC 500.For example, circuitry 520 may be provided (on an ASIC-customized basis)for making a connection from an I/O port 460 (e.g., an output) of an HLE200 near the upper left-hand corner of ASIC 500 to an I/O port 460(e.g., an input) of another HLE 200 near the bottom-center of the ASIC.As another example, circuitry 550 may be provided (on an ASIC-customizedbasis) for making a connection from an I/O port 460 (e.g., an output) ofan HLE 200 near the lower left-hand corner of ASIC 500 to an output port(not shown) of the ASIC. Two layers of customizable metal (andintervening customizable vias) may be needed to provide non-blocking,higher-level routing to, from, and/or between HLEs 200 in any desiredarrangement.

As is desirable in ASIC designs, the number of layers requiringcustomization (programming) in a device in accordance with the inventionis preferably relatively small. Illustrative layers requiringcustomization in what has been described thus far are primarily thelayer providing programmable vias 420/440 (FIGS. 4 and 6) between thehorizontal and vertical interconnection conductors of the HLEs and thelike, the layer providing programmable vias 470 (FIG. 8) for the I/Oports to the higher level interconnection circuitry, and the layer(s)providing the higher level interconnection circuitry itself.(Alternatively, all I/O port vias 470 can always be present and eitherconnected to higher level interconnection circuitry if needed (used), orbypassed by that circuitry if not needed (not used).)

An important advantage of the present invention is the fact that thefunction(s) of any FPGA LE can be readily mapped to one or more ASICHLEs (and vice versa). This makes it possible to provide an HLE-basedASIC equivalent of any user's programmed or configured FPGA (or viceversa) without re-synthesis of the user's logic at any level (apart fromthe easy re-mapping mentioned in the preceding sentence). This contrastsfavorably with what most structured ASIC vendors offer as FPGAequivalents. Typically such vendors use complex multi-gate or gate arraydesigns to construct the logic fabric. Because the building blocks ofthese logic fabrics tend to be unlike FPGAs, re-synthesis is requiredwhen using FPGAs for prototyping. This inflexibility adds verificationeffort to make sure the design prototyped in an FPGA is functionallyequivalent to the one to be fabricated in the structured ASIC.Re-synthesis of the logic is similarly required if it is desired toproduce a programmed FPGA that is equivalent to such a structured ASIC.The present invention avoids such re-synthesis when migrating in eitherdirection between a configured FPGA and an HLE-based ASIC. In addition,HLEs save space as compared to ASIC LEs that are structurally similar toFPGA LEs (because for each FPGA LE only as many HLEs are used as arerequired to perform the function(s) of the corresponding programmed FPGALE).

FIG. 18 shows an illustrative series of flow elements (i.e., stepsand/or results) that can be used to produce designs for equivalentLE-based FPGAs and HLE-based ASICs. FIG. 18 illustrates producing anFPGA design first, and then producing a substantially equivalent ASICdesign from that FPGA design. The desired logic (and possibly otherfunctions) that a user has specified is presented in flow element 610,typically in some standard form such as RTL (register transfer level).In flow element 620, the RTL is synthesized from the relatively genericspecification provided in flow element 610 to a form that lends itselfto implementation in FPGAs having particular characteristics (e.g., LEsincluding 4-LUTs and registers, etc.). Flow element 620 can be performedusing commercially available FPGA synthesis software tools such as theQuartus II product offered by Altera Corporation of San Jose, Calif. Theresult of synthesis 620 is then mapped to a particular FPGA technologyin flow element 630.

The next flow element 640 is conversion of the FPGA technology mappingto netlist and placement information for a particular FPGA within thegeneral FPGA technology contemplated in flow element 630. For example,flow element 640 works within the context of an FPGA having a particularnumber and arrangement of resources. Flow element 640 specifies which ofthese resources will perform each and every function the user's designrequires. FPGAs of the specified kind can be programmed from theinformation generated in flow element 640 via a bitstream.

To produce an HLE-based ASIC substantially equivalent to an FPGAprogrammed from information 640, step 650 is performed on the 640information in accordance with this invention. Step 650 is a 1-to-1mapping of functional units in the 640 information to one HLE or onegroup of HLEs that can minimally perform that functional unit. In thecontext of the examples discussed earlier in this specification, afunctional unit is either the combinational logic performed by the LUTin a given FPGA LE, or the register in a given FPGA LE. If thefunctional unit is combinational logic, step 650 maps that logic to thesmallest number of HLEs that can perform that function. This preferablyincludes using logic reduction as mentioned earlier to reduce the numberof selection levels required. Other techniques may also be used tosimplify (optimize) the logic for implementation in HLEs. If thefunctional unit is a register, step 650 maps that register to two HLEs,e.g., as shown in FIG. 13. Step 650 also selects which HLEs will performwhich of the functional units, and how each HLE should be configured toenable it to perform its role in implementing the functional unit it isassigned to. For example, step 650 preferably preserves the generalarrangement of functions on the FPGA in locating those functions on theequivalent ASIC (but preserving the general location is not required,and the equivalent HLE(s) can be placed in other parts of the targetASIC). Step 650 also specifies the higher-level routing that will berequired to provide needed connections to, from, and/or between the HLEsor HLE groups that cannot be provided at the lower, more direct,inter-HLE level. It is assumed that step 650 is working in the contextof an ASIC having sufficient capacity to implement the functionsspecified in the starting FPGA.

The result 660 of step 650 is ASIC netlist and placement informationthat can be used to specify the masks needed to fabricate an ASIC thatwill function equivalently to the starting FPGA (specified by the 640information). Advantageously, the 660 information has been deriveddirectly from the 640 information. No re-synthesis of the user'sstarting logic specification (e.g., as in step 620) has been required toperform this FPGA-to-ASIC conversion. There should accordingly be nodefect in the equivalency between FPGAs and ASICs produced according tothe FIG. 18 steps and results.

FIG. 19 shows another technique in accordance with the invention forproducing equivalent LE-based FPGAs and HLE-based ASICs. Flow elements710 and 720 are respectively similar to flow elements 610 and 620 inFIG. 18. The result of synthesis 720 that is keyed to a particular FPGAtechnology is used to produce both a mapping 730 of the user's logicdesign to an FPGA device or device class, and a mapping 750 of theuser's logic design to an HLE-based ASIC device or device class. Inother words, one common logic synthesis 720 is used as the basis forboth of mappings 730 and 750. Logical equivalence of these two mappingsis thereby assured. FPGA mapping 730 is used to produce netlist andplacement information 740 for a particular FPGA design (i.e.,programming or configuration). ASIC mapping 750 is used to produce aspecification 760 for the programmable masks of a particular,mask-programmable, HLE-based ASIC. An FPGA produced from information 740will be logically equivalent to an ASIC produced from information 760and vice versa. For example, if only the ASIC version is produced atfirst, but either FPGA mapping 730 or FPGA information 740 from theinitial synthesis 720 is retained, FPGAs equivalent to the ASIC canalways be produced without logic re-synthesis by using eitherinformation 740 or mapping 730 (to produce information 740 again). Thesame is true for movement from a first-produced FPGA to a later-neededequivalent ASIC, assuming retention of the initially produced mapping750 or information 760. The ASIC can be produced at any time from eitherinformation 760 or mapping 750 (now used as the basis for producinginformation 760 again). No logic re-synthesis is required, andequivalence of the later-produced ASIC to the initially produced FPGA isassured.

FIG. 20 shows another technique in accordance with the invention forproducing an LE-based FPGA from an already-produced HLE-based ASIC. Onceagain, flow elements 810 and 820 in FIG. 20 are respectively similar toflow elements 610 and 620 in FIG. 18 (or flow elements 710 and 720 inFIG. 19). Technology mapping 830 is keyed to an LE-based FPGAarchitecture, but it makes use of HLE library 840 to perform a step thattakes the mapping from an FPGA LE basis to an HLE basis. Flow element850 produces from mapping 830 a specification for the programmable masksof a mask-programmable, HLE-based ASIC. ASICs can be produced from thisspecification.

If an equivalent FPGA is needed later, it can be produced frominformation 850 as is further shown in FIG. 20. In flow element 860information 850 is re-mapped from HLE-based form to LE-based form. Thiscan be a 1-to-1 mapping of each HLE or group of HLEs that was derivedfrom an LE function in elements 830 and 840 back to the LE initiallyhaving that function. To facilitate this 1-to-1 mapping, information 850may include a record of how its various parts were derived from startingLEs. No logic re-synthesis is required in flow element 860. From element860, FPGA netlist and placement information 870 results and can be usedto produce FPGAs that are logically equivalent to ASICs produced frominformation 850.

Although already at least implicit in the foregoing discussion, it ishere expressly noted that technology mapping 830 is not free to assembleHLEs in any possible way to implement the user's logic design. To thecontrary, mapping 830 is constrained to use HLEs only as implementationsof functions that can be implemented in FPGA LEs. This makes possiblethe later 1-to-1 mapping 860 of information 850 back to LE-based form inelement 870.

FIGS. 21 a-c, 22 a-c, and 23 show examples of the various ways in whichthe NAND array 220 and possible other elements 230 (or equivalentcircuitry) in an HLE like that shown in FIG. 3 can be configured (e.g.,by mask programming) in accordance with further aspects of theinvention. FIGS. 21 a-c, for example, show various ways that an invertercan be provided. In FIG. 21 a one of NAND gates 220 is used with one ofits inputs tied to logic 1. In FIG. 21 b, one of inverters 230 is used.In FIG. 21 c both of NAND gates 220 a and 220 b or both of inverters 230a and 230 b are connected in parallel (by appropriately mask programminginterconnection resources in the HLE) to effectively provide one largerinverter, e.g., for stronger output driving from the HLE.

FIGS. 22 a-c shows several examples of how non-inverting buffers can beprovided. In FIG. 22 a NAND gates 220 a and 220 b are connected inseries, with one input terminal of each NAND gate tied to logic 1.Again, the routing resources of the HLE are mask programmed to connectthe NAND gates in series. In FIG. 22 b inverters 230 a and 230 b aresimilarly connected in series. In FIG. 22 c NAND gates 220 a and b areconnected in parallel in inverter configuration (e.g., as in FIG. 21 a)to effectively provide one larger first inverter 220 a/b, and inverters230 a and b are similarly connected in parallel to effectively provideone larger second inverter 230 a/b. As in FIG. 21 c, the effectivelylarger elements in FIG. 22 c provide stronger output drive from the HLE.

FIG. 23 shows use of one of NAND gates 220 a or 220 b to provide a NANDfunction.

Among the motivations for selection of some of the various options shownin FIGS. 21-23 may be the need for different amounts of output drivefrom different HLEs in a device employing HLEs in accordance with theinvention. A driver of a certain size is typically capable of driving acertain amount of parasitic loading. In an ASIC flow, it may benecessary or desirable to upsize the standard cell or metal programmablecell or insert another driver (buffer or inverter) to boost the drivingstrength if the amount of fanout is so large that the original drivingcell is not capable of driving the load. This implies an increase inarea due to upsizing or additional buffers/inverters. However, withHLE-based ASICs in accordance with this invention, it is readilypossible to make use of unused elements (HLEs or portions of HLEs) toincrease the driving strength (non-inversion or inversion), e.g.,through the lower level programmable interconnection resources. Theelements (e.g., 220 and/or 230) that may be used together in variousconfigurations such as those exemplified by FIGS. 21-23 do not have tobe in the same HLEs. They can instead be in adjacent or nearby HLEs.

As has already been mentioned, various techniques can be used toconserve the number of HLEs required to implement certain functions.Logic reduction, as mentioned above, is one example of suchHLE-conserving techniques. Another example is the case of one HLEdriving another HLE where the second HLE is configured as,illustratively, a 2-input NAND gate. If this happens, the ASIC flow canpack the NAND gate into the first HLE, thus cutting the number of HLEsfrom two down to one. There are many similar cases where an nth HLE canbe packed into the (n−1)th HLE, the (n−1)th HLE packed into the (n−2)thHLE, etc., especially with the inclusion of inverters like 230 in FIG.3. Other examples are !A AND B, A AND B, etc.

It will be understood that the foregoing is only illustrative of theprinciples of the invention, and that various modifications can be madeby those skilled in the art without departing from the scope and spiritof the invention. For example, the FPGAs and ASICs referred to herein donot have to be pure FPGAs or ASICs, respectively. A device can be partFPGA or part ASIC and part something else (e.g., part FPGA and partASIC). References herein to FPGAs and ASICs will be understood to referto the FPGA or ASIC portions of such hybrid devices.

Although via programming is generally referred to herein (see, e.g.,FIGS. 4-9) for logic construction and intra- and inter-HLE routing, itwill be understood that other types of programming (e.g., programmingusing metal optional links, fuses, antifuses, CRAM control, Flashcontrol, etc.) can be used instead or in addition if desired. If some ofthese other technologies are used, then above references to maskprogramming will also be understood to refer to these other programmingtechnologies, which may be implemented other than by customized orpartly customized masks. Similarly, although HLEs are generallydescribed herein as performing functions equivalent to FPGA LEs, HLEs asshown herein are high density and high performance components. As suchthey can also be used to form high performance intellectual property(“IP”) (e.g., digital signal processing (“DSP”) blocks, microprocessors,or the like), memory, etc.

1. Logic element circuitry comprising: selection circuitry for using afirst selection circuit input signal to select one of second and thirdselection circuit input signals as a selection circuit output signal;and logic circuitry for providing a logic circuit output signal which isa logical function of first and second logic circuit input signals.2-58. (canceled)